{"product_id":"9780367573669","title":"Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging","description":"Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems.This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.","brand":"Xing-Chang Wei","offers":[{"title":"Default Title","offer_id":45764714266942,"sku":"9780367573669","price":2728.42,"currency_code":"ZAR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0784\/4357\/7662\/products\/9780367573669_9223054f-7f14-418b-a587-b70741806d62.jpg?v=1707247705","url":"https:\/\/exclusivebooks.co.za\/products\/9780367573669","provider":"Exclusive Books Online","version":"1.0","type":"link"}