{"product_id":"9783319547138","title":"Testing of Interposer-Based 2.5D Integrated Circuits","description":"This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits.  The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies.  This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.","brand":"Ran Wang","offers":[{"title":"Default Title","offer_id":47595872682302,"sku":"9783319547138","price":3440.15,"currency_code":"ZAR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0784\/4357\/7662\/products\/9783319547138.jpg?v=1707707944","url":"https:\/\/exclusivebooks.co.za\/products\/9783319547138","provider":"Exclusive Books Online","version":"1.0","type":"link"}