{"product_id":"9789401779494","title":"Electrical Design of Through Silicon Via","description":"Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.","brand":"Manho Lee","offers":[{"title":"Default Title","offer_id":48618205118782,"sku":"9789401779494","price":0.0,"currency_code":"ZAR","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0784\/4357\/7662\/files\/9789401779494_90e03aff-d9d6-4068-bac4-ad45ed4cf595.jpg?v=1715107478","url":"https:\/\/exclusivebooks.co.za\/products\/9789401779494","provider":"Exclusive Books Online","version":"1.0","type":"link"}