This useful book addresses electrothermal problems in modern VLSI systems. It discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires. The authors present three important applications of VLSI electrothermal analysis: temperature-dependent electromigration diagnosis, cell-level thermal placement, and temperature-driven power and timing analysis.
Format:
CONTRIBUTORS: Yi-Kan Cheng, Ching-Han Tsai, Chin-Chi Teng, Sung-Mo (Steve) Kang
EAN: 9780792378617
COUNTRY: Netherlands
PAGES:
WEIGHT: 1140 g
HEIGHT: 235 cm
PUBLISHED BY: Springer
DATE PUBLISHED: 2000-06-30
CITY:
GENRE: TECHNOLOGY & ENGINEERING / Electrical, TECHNOLOGY & ENGINEERING / Electronics / Circuits / General
WIDTH: 155 cm
SPINE:
Book Themes:
Electrical engineering, Electronics: circuits and components
From the Foreword: `Continuing increases in the levels of circuit integration and concomitant increases in performance are sustaining the trend of increasing power dissipation in VLSI systems. A consequence is that the impact of temperature on the successful operation and reliability of devices must be comprehended during the design process.....This text provides a comprehensive formulation of the electrothermal analysis problem beginning with a summary of the sources of power dissipation in CMOS circuits and followed by a formulation of the effect of temperature on MOS devices.' Dr. Ralph K. Cavin, Vice President, Semiconductor Research Corporation