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Wafer Level 3-D ICs Process Technology

Chuan Seng Tan, Ronald J. Gutmann, L. Rafael Reif
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      This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
      Format: CONTRIBUTORS: Chuan Seng Tan, Ronald J. Gutmann, L. Rafael Reif EAN: 9780387765327 COUNTRY: United States PAGES: WEIGHT: 729 g HEIGHT: 235 cm
      PUBLISHED BY: Springer-Verlag New York Inc. DATE PUBLISHED: 2008-09-19 CITY: GENRE: TECHNOLOGY & ENGINEERING / General, TECHNOLOGY & ENGINEERING / Electronics / General, TECHNOLOGY & ENGINEERING / Materials Science / Electronic Materials, TECHNOLOGY & ENGINEERING / Materials Science / Thin Films, Surfaces & Interfaces WIDTH: 155 cm SPINE:

      Book Themes:

      Engineering: general, Materials science, Engineering applications of electronic, magnetic, optical materials, Electronics engineering

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      This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
      Format: CONTRIBUTORS: Chuan Seng Tan, Ronald J. Gutmann, L. Rafael Reif EAN: 9780387765327 COUNTRY: United States PAGES: WEIGHT: 729 g HEIGHT: 235 cm
      PUBLISHED BY: Springer-Verlag New York Inc. DATE PUBLISHED: 2008-09-19 CITY: GENRE: TECHNOLOGY & ENGINEERING / General, TECHNOLOGY & ENGINEERING / Electronics / General, TECHNOLOGY & ENGINEERING / Materials Science / Electronic Materials, TECHNOLOGY & ENGINEERING / Materials Science / Thin Films, Surfaces & Interfaces WIDTH: 155 cm SPINE:

      Book Themes:

      Engineering: general, Materials science, Engineering applications of electronic, magnetic, optical materials, Electronics engineering

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      Be the first to write a review
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