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High-Frequency Characterization of Electronic Packaging

Luc Martens
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      High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems. High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models. High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.
      Format: CONTRIBUTORS: Luc Martens EAN: 9780792383079 COUNTRY: Netherlands PAGES: WEIGHT: 940 g HEIGHT: 235 cm
      PUBLISHED BY: Springer DATE PUBLISHED: 1998-10-31 CITY: GENRE: TECHNOLOGY & ENGINEERING / Automation, TECHNOLOGY & ENGINEERING / Electrical, TECHNOLOGY & ENGINEERING / Microwaves WIDTH: 155 cm SPINE:

      Book Themes:

      Electrical engineering, Electronics engineering, Automatic control engineering

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      High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems. High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models. High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.
      Format: CONTRIBUTORS: Luc Martens EAN: 9780792383079 COUNTRY: Netherlands PAGES: WEIGHT: 940 g HEIGHT: 235 cm
      PUBLISHED BY: Springer DATE PUBLISHED: 1998-10-31 CITY: GENRE: TECHNOLOGY & ENGINEERING / Automation, TECHNOLOGY & ENGINEERING / Electrical, TECHNOLOGY & ENGINEERING / Microwaves WIDTH: 155 cm SPINE:

      Book Themes:

      Electrical engineering, Electronics engineering, Automatic control engineering

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