FREE delivery to all EXCLUSIVE BOOKS stores nationwide. FREE delivery to your door on all orders over R450. Excludes all international deliveries.

Interconnect Technology and Design for Gigascale Integration

Jeffrey A. Davis
    Product form
      FORMAT: Paperback / softback

      R 4,675.16 Price and availability exclusive to website

      YOU COULD EARN 4,675.16 FUTURE RETAIL DISCOUNTS.
      ESTIMATED DELIVERY: Approx. 10 - 15 Business Days
      BUY NOW PAY LATER
      From R 779.19 per month!
      3x monthly payments of R 1,558.38 with
      4x fortnightly payments of R 1,168.79 with
      This book is jointly authored by leading academic and industry researchers. The material is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in-depth exploration into interconnect-aware computer architectures.
      Format: Paperback / softback CONTRIBUTORS: Jeffrey A. Davis EAN: 9781461350880 COUNTRY: United States PAGES: WEIGHT: 652 g HEIGHT: 235 cm
      PUBLISHED BY: Springer-Verlag New York Inc. DATE PUBLISHED: 2012-10-14 CITY: GENRE: COMPUTERS / Design, Graphics & Media / CAD-CAM, TECHNOLOGY & ENGINEERING / Electrical, TECHNOLOGY & ENGINEERING / Electronics / General, TECHNOLOGY & ENGINEERING / Electronics / Circuits / General WIDTH: 155 cm SPINE:

      Book Themes:

      Electrical engineering, Electronics engineering, Electronics: circuits and components, Computer-aided design (CAD)

      Customer Reviews

      Be the first to write a review
      0%
      (0)
      0%
      (0)
      0%
      (0)
      0%
      (0)
      0%
      (0)
      This book is jointly authored by leading academic and industry researchers. The material is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in-depth exploration into interconnect-aware computer architectures.
      Format: Paperback / softback CONTRIBUTORS: Jeffrey A. Davis EAN: 9781461350880 COUNTRY: United States PAGES: WEIGHT: 652 g HEIGHT: 235 cm
      PUBLISHED BY: Springer-Verlag New York Inc. DATE PUBLISHED: 2012-10-14 CITY: GENRE: COMPUTERS / Design, Graphics & Media / CAD-CAM, TECHNOLOGY & ENGINEERING / Electrical, TECHNOLOGY & ENGINEERING / Electronics / General, TECHNOLOGY & ENGINEERING / Electronics / Circuits / General WIDTH: 155 cm SPINE:

      Book Themes:

      Electrical engineering, Electronics engineering, Electronics: circuits and components, Computer-aided design (CAD)

      Customer Reviews

      Be the first to write a review
      0%
      (0)
      0%
      (0)
      0%
      (0)
      0%
      (0)
      0%
      (0)

      Recently viewed products

      Login

      Forgot your password?

      Don't have an account yet?
      Create account